G.Skill Announced 2GB So-DIMM Memory with Cooper Heatsink

The memory manufacturer G.Skill has released two laptop-use 2GB So-DIMM memory modules, the DDR2-667 CL5 2GB (F2-5300CL5S-2GBSA) and DDR2-533 CL4 2GB (F2-5300CL4S-2GBSA) with 667MHz and 533MHz speeds respectively. Both memory modules use the 100% cooper heatsink with high thermal conductivity pad to reduce the heat resistance, according to G.Skill.

“As per the laptop market extends fast, we provide these 2GB modules to make the laptop can beat Microsoft Vista. We use the 100% cooper heatsink with 2.3Kw/mk high thermal conductivity pad to low down the heat resistance”, said G.Skill CEO Johnson Huang. “Thermal is the key issue for laptop users. We believe this cooper heatsink can make your laptop be faster and more stable.”

These new memory modules will be available through G.Skill’s authorized resellers and distributors worldwide. There is no info on F2-5300CL5S-2GBSA’s and F2-5300CL4S-2GBSA’s availability dates and prices.

G.Skill noted that the notebooks based on Intel 945PM Chipset currently only support up to 3GB of main memory.

The 2GB notebook memory modules were also announced by Corsair and Kingston.